8L,FR4,1OZ,Red Solder Mask, Immersion Gold



Product Description
Layers Counts Multilayer, 8L
Base Material FR-4, High TG etc.
Copper Thickness 1/3OZ, 1/2OZ, 1OZ, 2OZ, 3OZ
Board Thickness 31-236mil(0.8-6.0mm)
Min. Hole Size  8mil/0.20mm
Min. Line Width/Spacing  4mil/4mil ; 0.1mm/0.1mm
Surface Finishing  HASL (LF), Immersion Gold/ENIG, Chemical Tin, Chemnical Silver, OSP, Gold Finger etc
Solder Mask  (Matt)Green, (Matt)Black, White, Blue, Red, Yellow, Grey;
Profiling  CNC Routing, V-scoring, Punching, Beveling
Material Brand  Shengyi, Kingboard, Iteq, Isola etc.
Certificate  UL, CUL, ISO9001, ISO14001, TS16949 and SGS RoHs
Special Process
BGA  Fine-Pitch
Min Trace/Spacing  4/4mil, 0.1/0.1mm

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