6L HDI, Blind/Burried vias, resin fill, Matt Green mask



Product Description
Layers Counts Multilayer, 6L, HDI, Blind/berried vias
Base Material FR-4, High TG etc.
Copper Thickness 1/3OZ, 1/2OZ, 1OZ, 2OZ, 3OZ
Board Thickness 24-236mil(0.6-6.0mm)
Min. Hole Size  4mil/0.10mm
Min. Line Width/Spacing  4mil/4mil ; 0.1mm/0.1mm
Surface Finishing  HASL (LF), Immersion Gold/ENIG, Chemical Tin, Chemnical Silver, OSP, Gold Finger etc
Solder Mask  (Matt)Green, (Matt)Black, White, Blue, Red, Yellow, Grey;
Profiling  CNC Routing, V-scoring, Punching, Beveling
Material Brand  Shengyi, Kingboard, Iteq, Isola etc.
Certificate  UL, CUL, ISO9001, ISO14001, TS16949 and SGS RoHs
Special Process
Special Procss  Resin fill,VIP technology
Laser drilling  Applicable

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